SECURE WAFER HANDLING. GENTLE CONTACT. RELIABLE PERFORMANCE.
Semiconductor Handling
Dry-adhesive gripping solutions for reliable wafer transport, precise placement and demanding semiconductor environments.
High acceleration
Reliable lateral grip for fast wafer transfer and positioning.
Gentle release
Controlled release with low normal forces during pick-up and placement.
Surface integrity
Designed to reduce the risk of marks, scratches and unwanted residues.
Cleanroom & Vacuum
Configurations available for demanding cleanroom and vacuum applications.
BUILT FOR SEMICONDUCTOR PROCESSES
Where INNOCISE fits into your process.
In wafer handling, reliable grip is only part of the challenge. Precise positioning, controlled release and surface protection are equally critical throughout the process.
INNOCISE provides dry-adhesive gripping solutions for wafer transfer, positioning and temporary holding, engineered around the requirements of your component and process.
Stable wafer handling during fast movements, acceleration and deceleration.
Reliable wafer transfer between carriers, tools and process stations.
Stable, controlled holding during processing, inspection and other handling steps.
BUILT FOR SEMICONDUCTOR PROCESSES
Where INNOCISE fits into your process.
In wafer handling, reliable grip is only part of the challenge. Precise positioning, controlled release and surface protection are equally critical throughout the process.
INNOCISE provides dry-adhesive gripping solutions for wafer transfer, positioning and temporary holding, engineered around the requirements of your component and process.
Stable wafer handling during fast movements, acceleration and deceleration.
Reliable wafer transfer between carriers, tools and process stations.
Stable, controlled holding during processing, inspection and other handling steps.
YOUR PATH TO THE RIGHT SOLUTION
The right contact for your wafer.
From flat to warped wafers, choose a standardized gripping solution or go beyond standard with a solution engineered around your process.
Standard Wafer Pads
Standardized gripping pads for reliable handling of flat wafers and repeatable processes.
IDEAL FOR
- Flat and thin wafers
- Repeatable processes
- Defined contact geometries
Warped Wafer Pads
Designed to accommodate wafer deformation and maintain reliable contact across non-planar surfaces.
DESIGNED FOR
- Warped or bowed wafers
- Varying wafer topographies
- Non-planar contact conditions
Custom Wafer Solutions
When wafer geometry, process conditions or integration requirements go beyond standardized solutions, we engineer the gripping interface around your application.
WHEN STANDARD IS NOT ENOUGH
- Specific wafer geometries
- Special process environments
- Custom carrier or end-effector designs
- New OEM platforms
APPLICATION VALIDATION
Performance you can validate.
A gripping solution needs to perform under the conditions that matter in your process. INNOCISE evaluates key handling characteristics using dedicated test setups and representative samples.
> 7.4 N/cm²
Shear adhesion
< 0.2 N/cm²
Normal adhesion
Up to 4 g
Handling acceleration
< 20 µm
High placement accuracy
Performance depends on the application. That’s why INNOCISE evaluates gripping, release and dynamic behavior under conditions relevant to your process.
THE TECHNOLOGY BEHIND THE CONTACT
More than a gripping surface.
Gecomer® Technology uses bio-inspired microstructures and van der Waals interactions to create reliable dry-adhesive contact. By engineering the interaction between microstructure, material and contact geometry, gripping performance can be adapted to different handling requirements.
Are you ready to get started?
What is your handling challenge?
Discuss your process requirements directly with our experts.